Assemblies including heat dispersing elements and related systems and methods

ABSTRACT

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/795,690, filed Oct. 27, 2017, pending, the disclosure of which ishereby incorporated herein in its entirety by this reference.

TECHNICAL FIELD

Embodiments of the present disclosure relate to assemblies includingheat dispersing elements and to related methods. More specifically,various embodiments relate to assemblies including multiple heatdispersing elements to provide cooling for one or more heat-generatingcomponents on a substrate and to related methods.

BACKGROUND

Maintaining sufficiently low operating temperatures for electronicheat-generating components, such as integrated circuit devices, isdesirable to ensure their proper operation and to extend their usefullife. A trend in contemporary circuit design is to provide an assemblyof multiple heat-generating components on a circuit board. A consequenceof providing multiple heat-generating components on a circuit board,which may include integrated circuit devices operating at relativelyhigh speeds, is substantial heat production that may be detrimental tothe operation and life of those components. Conventionally, heatdissipating structures are used to transfer heat from theheat-generating components to an area where the heat can be dissipated,such as the atmosphere. In some applications, in addition to heatdissipating structures, or instead of, forced ventilation may also beprovided to remove the heat from the devices.

Some conventional approaches to thermal management of packagedelectronic devices require associating individual heat dissipatingstructures with each of the individual components. The use of individualheat dissipating structures can be expensive and the associatedinstallation may be labor intensive or require significant capitalinvestment in complex assembly equipment. Further, as moreheat-generating components are provided onto ever-smaller circuitboards, each heat dissipating structure must be accurately aligned withits neighbor to ensure proper function. Finally, as more heat-generatingcomponents are packed into a smaller volume, the use of heat dissipatingstructures may be impractical, if not impossible, due to sizingconstraints.

In the case of heat-generating components, such as memory devices, suchdevices are conventionally provided in computers and other electronic inthe form of semiconductor-based integrated circuits. There are manydifferent types of memory devices including, synchronous dynamicrandom-access memory (SDRAM), dynamic random-access memory (DRAM), andnon-volatile memory such as Flash memory (NAND and NOR), EEPROM, FeRAMand MRAM. As the performance and complexity of electronic systemsincrease, the requirement for additional memory in memory systems alsoincreases. The trend in the semiconductor industry is toward smallermemory devices that may be fabricated as high-density circuits on asingle semiconductor chip. Miniaturization of transistor devices andcircuits may be achieved by reducing the size of at least some of thefeatures of devices so that the resulting devices occupy a smallersurface area of a wafer.

To reduce costs of fabricating such high-density memory arrays, theparts count must be kept to a minimum. This means being able to achievea higher density of memory on a single chip. However, as memory devicesdecrease in size while increasing the number of memory cells in a memoryarray, the volume available to provide adequate heat dissipation is alsodecreased.

In conventional memory module designs, heat spreaders may be attached toprimary and secondary sides of a module. This approach is inadequate tocool new generations of memory module having higher power but smallerpitch. For example, fifth generation double data rate RAM may reach 15 Wper dual in-line memory module (DIMM) while having a reduced, about 7.6mm pitch between adjacent modules in a multi-module assembly. Thisconfiguration is expected impose a significant challenge when multipleDIMMs work together in the server system.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a perspective view of an assembly including heat dissipationelements in accordance with embodiments of the present disclosure.

FIG. 2 is a front view of the assembly of FIG. 1.

FIG. 3 is a side view of the assembly of FIG. 2 with some componentsremoved for clarity.

FIG. 4 is a perspective view of an assembly including heat dissipationelements in accordance with embodiments of the present disclosure.

FIG. 5 is a front view of the assembly of FIG. 4.

FIG. 6 is a schematic block diagram illustrating one embodiment of anelectronic system that includes an assembly like the assemblies shown inFIGS. 1 through 5.

DETAILED DESCRIPTION

As used herein, any relational term, such as “first,” “second,” “over,”“under,” “on,” “underlying,” “overlying,” etc., is used for clarity andconvenience in understanding the disclosure and drawings and does notconnote or depend on any specific preference, orientation, or order.

As used herein, the terms “distal” and “proximal” describe positions ofelements in relation to a substrate upon which the elements arepositioned. For example, the term “distal” refers to a positionrelatively more distant from the substrate, and the term “proximal”refers to a position in closer relative proximity to the substrate.

The following description provides specific details, such as materialtypes and processing conditions in order to provide a thoroughdescription of embodiments of the present disclosure. However, a personof ordinary skill in the art will understand that the embodiments of thepresent disclosure may be practiced without employing these specificdetails. Indeed, the embodiments of the present disclosure may bepracticed in conjunction with conventional semiconductor fabricationtechniques employed in the industry. In addition, the descriptionprovided below may not form a complete process flow for manufacturing adevice or system. The structures described below do not form a completedevice or system. Only those process acts and structures necessary tounderstand the embodiments of the present disclosure are described indetail below. Additional acts to form complete conductive structures andsemiconductor devices may be performed by conventional fabricationtechniques. Further, the acts described below may be performed inmultiple acts or multiple acts may be performed substantiallysimultaneously.

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which is shown,by way of illustration, specific embodiments in which the presentdisclosure may be practiced. These embodiments are described insufficient detail to enable a person of ordinary skill in the art topractice the present disclosure. However, other embodiments may beutilized, and structural, logical, and electrical changes may be madewithout departing from the scope of the disclosure. The illustrationspresented herein are not meant to be actual views of any particularsystem, device, structure, or memory cell, but are merely idealizedrepresentations that are employed to describe the embodiments of thepresent disclosure. The drawings presented herein are not necessarilydrawn to scale. Additionally, elements common between drawings mayretain the same numerical designation.

As used herein, the term “substantially” in reference to a givenparameter, property, or condition means and includes to a degree thatone skilled in the art would understand that the given parameter,property, or condition is met with a small degree of variance, such aswithin acceptable manufacturing tolerances. For example, a parameterthat is substantially met may be at least about 90% met, at least about95% met, or even at least about 99% met.

FIG. 1 is a perspective view of an assembly 100 including heatdissipation elements. As shown in FIG. 1, the assembly 100 may includeone or more heat-generating devices 104 or components (e.g., electronicdevices or integrated circuits (IC), such as, for example, memorymodules, application-specific integrated circuits (ASIC), combinationsthereof, or other electronic devices). In some embodiments, the memorymodules may comprise random access memory (RAM) (e.g., volatile memory),such as, for example, dynamic random-access memory (DRAM), synchronousdynamic random-access memory (SDRAM) (e.g., double data rate synchronousdynamic random access memory (DDR SDRAM), such as fifth generation ofdouble data rate synchronous dynamic random access memory (DDRS SDRAM)).

It is noted that while assemblies described herein may make specificreference to use with a RAM device, the disclosure is not so limited andmay be applied to other electronic devices, integrated circuits, and/ormemory devices.

In some embodiments, the assembly may be part of a system, such as acomputer or computer hardware component, a server, and/or othernetworking hardware component. In some embodiments, the assembly may bepart of a system, such as a cellular telephone, tablet, a digitalcamera, a personal digital assistant (PDA), portable media (e.g., music)player, etc. The electronic device further may include at least oneelectronic signal processor device (often referred to as a“microprocessor”). The electronic device may, optionally, furtherinclude one or more input devices for inputting information into theelectronic device by a user, such as, for example, a mouse or otherpointing device, a keyboard, a touchpad, a touchscreen, a button, or acontrol panel and one or more output devices for outputting information(e.g., visual or audio output) to a user such as, for example, amonitor, display, printer, speaker, etc., as discussed below in greaterdetail.

As depicted in FIG. 1, the assembly 100 may include multipleheat-generating devices 104 coupled to a base substrate 102 (e.g., acommon substrate, such as, a motherboard, main board, system board,baseboard, planar board, logic board, or another type of circuit board)via one or more connectors 106. As discussed in detail in relation toFIG. 2, each of the heat-generating devices 104 may include a substrate108 (e.g., circuit board) having electronic devices (e.g., one or morememory devices 110) electronically and physically coupled to thesubstrate 108.

One or more heat dissipation structures (e.g., heat spreaders 112) maybe positioned proximate the heat-generating devices 104. For example,each heat-generating device 104 may be bordered by (e.g., positionedadjacent, coupled to, abutted with) heat spreaders 112 (e.g., on twoopposing lateral or major side portions of the heat-generating devices104). In some embodiments, the heat spreaders 112 may abut (e.g., be indirect physical contact) a portion of the heat-generating device 104. Insome embodiments, the heat spreaders 112 may be positioned adjacent tothe heat-generating devices 104, but may not be coupled to theheat-generating devices 104 or the assembly. For example, the heatspreaders 112 (e.g., and the heat sink 116) may slide over at least aportion the heat-generating device 104 in order to assemble the assembly100 and position the heat spreaders 112.

The heat spreaders 112 may be configured to dissipate heat energy fromthe heat-generating devices 104. The heat spreaders 112 may enable heatenergy from one or more of the heat-generating devices 104 to transferto (e.g., pass through, disperse to) one or more of the heat spreaders112 to be dissipated to a location distal to the assembly 100. Forexample, heat energy may be passed from the heat-generating devices 104to the heat spreaders 112 and may disperse through the heat spreaders112 (e.g., which heat spreaders 112 may be positioned directly adjacentthe heat-generating devices 104). In some embodiments, the heatspreaders 112 may be sized to substantially cover one side of theheat-generating devices 104 (e.g., may cover an entirety of one side ofthe heat-generating device 104). For example, the heat spreaders 112 maycomprise a full DIMM heat spreader 112 (FDHS). In other embodiments, theheat spreaders 112 may be of any size, shape, or arrangement suitable todissipate heat from the heat-generating devices 104.

The heat spreaders 112 may comprise a thermally conductive material tofacilitate heat dissipation. For example, the heat spreaders 112 maycomprise aluminum, gold, copper, silver, indium, tin, metal alloys, athermally conductive composite material, or combinations thereof.

The assembly 100 includes one or more additional heat dissipationstructures. For example, an additional heat dissipation structure maycomprise a heat sink 116 that extends over each of the heat-generatingdevices 104. As depicted, the heat sink 116 may extend past (e.g.,overhang) the heat-generating devices 104 on one or more sides of theheat-generating devices 104 (e.g., on four lateral sides).

The heat sink 116 may be configured to dissipate heat energy from theheat-generating devices 104. The heat sink 116 may enable heat energyfrom one or more of the heat-generating devices 104 to transfer to(e.g., pass through, disperse to) the heat sink 116 to be dissipated toa location distal to the assembly 100. For example, the heat sink 116shown in FIG. 2 is a monolithic-style heat sink 116 having a pluralityof laterally separated, vertically protruding fins 118 configured todissipate heat, either through natural radiation and convection, or incombination with forced ventilation. The fins 118 may be of any size,shape, or arrangement suitable to dissipate heat from theheat-generating devices 104. For example, the fins 118 may comprisestraight fins, pin fins, flared fins, combinations thereof, etc.

In other embodiments, the heat sink 116 may not be a monolithic-styleheat sink 116, but may have any profile, configuration, or structuredesirable to dissipate heat from the heat-generating devices 104, eitherthrough natural radiation and convection, or in combination with forcedventilation. For example, heat sink 116 may include channels, cavities,and/or bores extending through the heat sink 116 (e.g., may lack fins),through which cooling air or other fluid may pass or be forced.

The heat sink 116 may also comprise a thermally conductive material tofacilitate heat dissipation. For example, the heat sink 116 may comprisealuminum, gold, copper, silver, indium, tin, metal alloys, a thermallyconductive composite material, or any combinations thereof.

Cooling air or other fluid may pass or be forced over and/or through theheat dissipating structures (e.g., the heat spreaders 112 and/or theheat sink 116) and may assist in transferring (e.g., removing) heatenergy from the heat spreader 112 and heat sink 116. For example, fluid(e.g., atmospheric air) may be passed over and/or through the heatspreader 112 and heat sink 116 passively (e.g., via the natural flow ofair in an environment) and/or actively (e.g., by a fan) to assist intransferring heat energy from the heat-generating devices 104.

FIG. 2 is a front view of the assembly 100 shown in FIG. 1. As shown inFIG. 2, the heat-generating devices 104 of the assembly 100 may includethe substrate 108 (e.g., circuit board) having the electronic devices(e.g., memory devices 110) coupled to the substrate 108. In someembodiments, the substrate 108 may have a plurality of memory devices110 (e.g., four, six, eight, ten, twelve, fourteen, sixteen, eighteen,twenty, or more, or variations therebetween) connected to each majorside of the substrate 108 (e.g., the sides having the greatest surfacearea). In some embodiments, the memory devices 110 may be aligned inmultiple rows (e.g., two rows) extending along each major side of thesubstrate 108. The rows on one side of the substrate 108 may be alignedwith, or located between, the rows on the opposing side of the substrate108. In other embodiments, the memory devices 110 may be scatteredand/or staggered along each major side of the substrate 108.

As depicted, an outer or distal portion 120 of the memory devices 110(e.g., the portion further from the attachment point of the memorydevice 110 to the substrate 108) may be positioned adjacent to (e.g.,abutted with, forming a common boundary with, in direct physical contactwith, thermally and/or mechanically attached with) a respective heatspreader 112. Such direct contact may assist in the transfer of heatenergy from the memory devices 110 to the heat spreaders 112.

One or more of the substrates 108 (e.g., each substrate 108) may extendfrom the base substrate 102 (e.g., from connectors 106) to a locationadjacent to the heat sink 116. For example, the substrates 108 may eachextend to the heat sink 116 and be in contact with (e.g., directphysical contact, abutted with, forming a common boundary with,thermally and/or mechanically attached with) a surface (e.g., a lowersurface 122) of the heat sink 116 that is positioned relatively closerto the base substrate 102. In such an embodiment, the substrates 108 maybe abutted with, but not physically attached to, the lower surface 122of the heat sink 116. In some embodiments, the substrates 108 may beabutted with and coupled to the lower surface 122 of the heat sink 116(e.g., via another material or element, such as a suitable thermalinterface material (TIM), for example, a thermally conductive epoxy orother polymer or a thermally conductive tape). Such direct contact mayassist in the transfer of heat energy from the substrate 108 to the heatsink 116.

In some embodiments, one or more of the heat spreaders 112 (e.g., eachheat spreader 112) may extend from the base substrate 102 (e.g., from alocation proximate the connectors 106) to a location adjacent to theheat sink 116. For example, the heat spreaders 112 may each extend tothe heat sink 116 and be in contact with (e.g., direct physical contact,abutted with, forming a common boundary with, thermally and/ormechanically attached with) a surface (e.g., a lower surface 122) of theheat sink 116 that is positioned relatively closer to the base substrate102. In such an embodiment, the heat spreaders 112 may be abutted with,but not physically attached to, the lower surface 122 of the heat sink116. In some embodiments, the heat spreaders 112 may be abutted with andcoupled to the lower surface 122 of the heat sink 116 (e.g., via asuitable TIM such as a thermally conductive epoxy or other polymer or athermally conductive tape). Such direct contact may assist in thetransfer of heat energy from the heat spreaders 112 to the heat sink116. Such positioning may act to define fluid channels 123 between thesubstrates 108 and memory devices 110. For example, a portion of theheat sink 116 and the heat spreaders 112 (e.g., along with portions ofthe connectors 106 and the base substrate 102) may define channels 123that enhance the removal of heat energy from at least the heat spreaders112 by directing fluid (e.g., air) through the substantially enclosedchannels 123.

In some embodiments, one or more of the heat spreaders 112 may comprisea substantially flat (e.g., planar) plate extending along a majority of(e.g., an entirety of) one major side of an adjacent substrate 108and/or memory devices 110. In some embodiments, one or more of the heatspreaders 112 may comprise heat dissipation features, such as, forexample, heat-dissipating fins extending transverse to a major plane ofheat spreaders 112.

FIG. 3 is a side view of the assembly of FIG. 2 with the heat spreaders112 omitted for clarity. As shown in FIG. 3, each substrate 108 mayinclude memory devices 110 (e.g., twenty memory devices 110 and acontrol/buffer unit 111 on each major side) coupled to the basesubstrate 102 via the connector 106. The substrate 108 may extend to andbe in direct contact (e.g., mechanical and thermal contact) with theheat sink 116.

FIG. 4 is a perspective view of an assembly 200 including heatdissipation elements. The assembly 200 may be similar to and includesimilar components to the assembly 100 described above in relation toFIGS. 1 through 3. As shown in FIG. 4, the assembly 200 may include oneor more heat-generating devices 204 or components (e.g., memory devices210 (FIG. 5) coupled to substrates 208) on a base substrate 202. One ormore heat dissipation structures (e.g., heat spreaders 212, heat sink216) may be positioned proximate the heat-generating devices 204.

The assembly 200 includes a fluid flow feature (e.g., chassis 224) thatassists in directing fluid flow about (e.g., through) one or morecomponents of the assembly 200. For example, the chassis 224 may extendaround a portion of the assembly 200 (e.g., around a majority of theheat-generating devices 204 and may at least partially enclose theheat-generating devices 204). The chassis 224 may include one or moreopenings. For example, the chassis 224 may include openings 226positioned at opposing ends of the chassis 224 to enable fluid flowthrough the chassis 224 by enabling fluid (e.g., air) to flow in oneopening 226, to flow through the chassis 224 and around theheat-generating devices 204, and to exit through the other opening 226at the opposing end of the chassis 224.

In some embodiments, a combination of the chassis 224 and the basesubstrate 202 may partially enclose (e.g., surround, extend around) theheat-generating devices 204. For example, a first side of the chassis224 may be positioned adjacent (e.g., coupled to) the base substrate 202on a first side of the assembly 200, the chassis 224 may extend aroundthe heat-generating devices, and a second side of the chassis 224 may bepositioned adjacent (e.g., coupled to) the base substrate 202 on asecond side of the assembly 200. As depicted, the chassis 224 may extendaround multiple sides of the heat-generating devices 204 (e.g., threesides) and may be coupled to the base substrate 202 in order to enclosethe heat-generating devices 204 about at least one axis of the assembly200.

FIG. 5 is a front view of the assembly 200 of FIG. 4. As shown in FIG.5, the chassis 224 may define a channel through the assembly 200 and mayextend around the substrates 208, the memory devices 210, the heatspreaders 212, and the heat sink 216. In some embodiments, the chassis224 may contact (e.g., be coupled with) one or more of the components ofthe assembly 200 (e.g., the base substrate 202 and/or the heat sink216). In some embodiments, clearance (e.g., spacing for fluid flow) maybe provided between the chassis 224 and one or more of the components ofthe assembly 200 (e.g., the base substrate 202, the heat spreaders 212,and/or the heat sink 216). For example, the chassis 224 may extend aboutthe heat sink 216 while being spaced from the heat sink 216.

In some embodiments, one or more resilient elements (e.g., springs 228)may be positioned between the chassis 224 (e.g., coupled to the chassis224) and the heat sink 216 in order to enhance the contact between theheat sink 216 and one or more of the substrates 208 and the heatspreaders 212. For example, the springs 228 may bias the heat sink 216against the substrates 208. The underside of heat sink 216 may beslotted to receive ends of the substrates 208, the heat spreaders 212,or both to enhance heat transfer and lend structural stability to theassembly.

Referring to FIGS. 4 and 5, in operation, cooling air or other fluid maypass or be forced over and/or through the heat dissipating structures(e.g., the heat spreaders 212, the heat sink 216, and, optionally,through the chassis 224) and may assist in transferring (e.g., removing)heat energy from the heat spreader 212 and heat sink 216, which heatenergy is transferred to the heat spreader 212 and heat sink 216 fromthe heat-generating devices 204 (e.g., the substrates 208 and/or memorydevices 210). For example, fluid (e.g., atmospheric air) may be passedover and/or through the heat spreader 212 and heat sink 216 (e.g.,through the channel defined at least partially by the chassis 224)passively and/or actively to assist in transferring heat energy from theheat-generating devices 204.

In some embodiments, the fluid flow may also directly transfer heat fromthe heat-generating devices 204 along with the heat spreader 212 andheat sink 216.

The assemblies 100, 200 as shown in FIGS. 1 through 5 may be used inembodiments of electronic systems of the present disclosure. Forexample, FIG. 6 is a block diagram of an illustrative electronic system300 according to the present disclosure. The electronic system 300 maycomprise, for example, a computer or computer hardware component, aserver or other networking hardware component, a cellular telephone, adigital camera, a personal digital assistant (PDA), portable media(e.g., music) player, etc. The electronic system 300 includes at leastone electronic device 301, such as one of the assemblies 100, 200 (e.g.,a RAM memory assembly) shown and described above with reference to FIGS.1 through 5. The electronic system 300 further may include at least oneelectronic signal processor device 302 (often referred to as a“microprocessor”). The electronic system 300 may, optionally, furtherinclude one or more input devices 304 for inputting information into theelectronic system 300 by a user, such as, for example, a mouse or otherpointing device, a keyboard, a touchpad, a button, or a control panel.The electronic system 300 may further include one or more output devices306 for outputting information (e.g., visual or audio output) to a usersuch as, for example, a monitor, display, printer, speaker, etc. The oneor more input devices 304 and output devices 306 may communicateelectrically with at least one of the electronic device 301 and theelectronic signal processor device 302.

Embodiments of the present disclosure may be particularly useful inimproving thermal performance of assemblies (e.g., electronicassemblies) by enabling a majority of the components (e.g., allcomponents) of the assembly (e.g., a memory assembly) to be cooled. Theassembly requires only a relatively low cost heat sink on an upperportion of the assembly top and, optionally, a chassis to cover theassembly and guide air flow through the assembly. Such an assembly maybe utilized for single memory module or multiple modules, includingmultiple modules have relatively tight lateral spacing between modules.Such assemblies may not require the use of local active cooling features(e.g., fans positioned directly adjacent the heat sinks) to provideadequate air flow, but may move the cooling fluid using only convection.For a system, system cooling air (e.g., flow that is provided at asystem level for multiple assemblies) may be guided to flow through theassembly. Such assemblies may be relatively easy to install by placing aheat sink over the top of a memory module array and extending heatspreaders from the heat sink over one or both sides of each memorymodule in the array and, optionally, placing a chassis to cover thearray. The chassis may be a separate component or be part of the heatsink assembly.

Accordingly, an assembly includes at least one substrate, at least oneelectronic device coupled to the substrate, and heat dissipationelements. The heat dissipation elements may comprise at least one heatspreader in physical communication with the at least one electronicdevice and at least one heat sink in thermal communication with the atleast one heat spreader.

Further, an assembly may include a base substrate, circuit boardscoupled to the base substrate, each circuit board having at least oneheat-generating component coupled thereto, and heat dissipationelements. The heat dissipation elements include heat spreaders, eachbeing in physical communication with the at least one heat-generatingcomponent of one of the printed circuit boards and at least another heatdissipation element in physical communication with the heat spreaders.The assembly further includes a chassis extending around at least aportion of the printed circuit boards and the heat dissipation elements.

Further still, a system may include at least one electronic signalprocessor, a semiconductor device configured to communicate electricallywith the at least one electronic signal processor, and a memoryassembly. The memory assembly includes a base substrate comprisingconnectors, circuit boards, each being coupled to one connector andhaving memory devices coupled on opposing sides of the respectivecircuit board, and heat dissipation elements. The heat dissipationelements include heat spreaders positioned on the opposing sides of theprinted circuit boards and a heat sink in thermal communication witheach of the heat spreaders and at least one of the circuit boards.

Further still a method of dissipating heat energy includes transferringheat energy from memory devices coupled to circuit boards to heatspreaders positioned adjacent to the memory devices and transferring theheat energy from the heat spreaders to a heat sink that is in thermalcommunication via an abutting interface with each of the circuit boards.

While the present disclosure is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, the present disclosure is not intended to be limited to theparticular forms disclosed. Rather, the present disclosure is to coverall modifications, combinations, equivalents, and alternatives fallingwithin the scope of the present disclosure as defined by the followingappended claims and their legal equivalents.

What is claimed is:
 1. An assembly, comprising: a base substrate;substrates in electronic communication with the base substrate; one ormore electronic devices coupled to at least one substrate of thesubstrates; and heat dissipation elements comprising: a heat spreaderadjacent to the one or more electronic devices; a heat sink at a distalend of the substrates at a location opposite the base substrate, theheat sink in thermal communication with the heat spreader; and a chassisincluding openings at opposing ends, the chassis comprising: a firstside coupled to the base substrate on a first side of the assembly; asecond side coupled to the base substrate on a second side of theassembly; and a portion adjacent the heat sink.
 2. The assembly of claim1, further comprising a resilient element between the chassis and theheat sink.
 3. The assembly of claim 1, wherein the at least onesubstrate comprises a circuit board.
 4. The assembly of claim 3, whereinthe electronic device comprises a memory device coupled to the circuitboard.
 5. The assembly of claim 1, wherein the one or more electronicdevices comprises multiple electronic devices, each of the substrateshaving at least one of the multiple electronic devices coupled thereto.6. The assembly of claim 5, wherein each of the substrates physicallycontacts the heat sink.
 7. The assembly of claim 1, wherein the heatsink overlies and laterally extends beyond each of the substrates. 8.The assembly of claim 1, wherein the portion of the chassis contacts theheat sink.
 9. The assembly of claim 8, wherein the portion of thechassis is coupled with the heat sink.
 10. The assembly of claim 1,wherein: the one or more electronic devices comprises multipleelectronic devices; and the at least one substrate has two of themultiple electronic devices positioned on opposing sides thereof. 11.The assembly of claim 10, further comprising an additional heatspreader, the heat spreader and the additional heat spreader positionedon each of the opposing sides of the at least one substrate, each of theheat spreader and the additional heat spreader in physical communicationwith the two of the multiple electronic devices.
 12. A system,comprising: an electronic signal processor; and a memory assemblyconfigured to communicate electrically with the electronic signalprocessor, the memory assembly comprising: a base substrate comprisingconnectors; circuit boards having opposing sides, each circuit board ofthe circuit boards coupled to a respective connector of the connectorsand having memory devices coupled to each of the opposing sides; heatdissipation elements comprising: heat spreaders positioned on each ofthe opposing sides of the circuit boards; and a heat sink in thermalcommunication with the heat spreaders; and a chassis extending aroundthe circuit boards and the heat dissipation elements, the chassiscomprising: openings at opposing ends thereof and configured to enablefluid flow therethrough; a first side coupled to the base substrate on afirst side of the memory assembly; a second side coupled to the basesubstrate on a second side of the memory assembly; and a portionadjacent the heat sink.
 13. The system of claim 12, wherein the chassisextends around three sides of the memory assembly.
 14. The system ofclaim 12, further comprising a resilient element between the chassis andthe heat sink.
 15. The system of claim 12, wherein each of the heatspreaders is in physical contact with at least one of the memorydevices.
 16. The system of claim 12, wherein each circuit board of thecircuit boards has more than one memory device on each side thereof. 17.A method of dissipating heat energy from an assembly, the methodcomprising: transferring heat energy from memory devices coupled tocircuit boards to heat spreaders positioned adjacent to the memorydevices, the circuit boards being electronically coupled to a basesubstrate at a first location; transferring heat energy from the heatspreaders to a heat sink positioned at a second location of the circuitboards away from the first location, the heat sink being in thermalcommunication with the memory devices of the circuit boards; andtransferring heat energy to a fluid flow by directing the fluid flowthrough openings at opposing ends of a chassis and through a channeldefined by the chassis, a first side of the chassis coupled to the basesubstrate on a first side of the assembly and a second side of thechassis coupled to the base substrate on a second side of the assembly.18. The method of claim 17, further comprising transferring heat energyfrom the circuit boards to the heat sink via an abutting interfacebetween the heat sink and each of the circuit boards.
 19. The method ofclaim 17, further comprising providing the chassis around the memorydevices.
 20. The method of claim 17, further comprising directing thefluid flow through an additional channel partially defined by the memorydevices and a surface of the heat sink.